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The integration of a low-k material with high organic content in a non-etchback process

dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.date.accessioned2021-09-29T15:50:49Z
dc.date.available2021-09-29T15:50:49Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1644
dc.sourceIIOimport
dc.titleThe integration of a low-k material with high organic content in a non-etchback process
dc.typeProceedings paper
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorVan den hove, Luc
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage75
dc.source.endpage80
dc.source.conferenceULSI XI : Advanced Metallization and Interconnect Systems for ULSI Applications
dc.source.conferencedate3/10/1995
dc.source.conferencelocationPortland, OR USA
imec.availabilityPublished - open access


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