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Characteristics and integration challenges of FinFET-based devices for (Sub-)22nm technology nodes circuit applications

dc.contributor.authorVeloso, Anabela
dc.contributor.authorVan Dal, Mark
dc.contributor.authorCollaert, Nadine
dc.contributor.authorDe Keersgieter, An
dc.contributor.authorWitters, Liesbeth
dc.contributor.authorRooyackers, Rita
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorBrus, Stephan
dc.contributor.authorDuffy, Ray
dc.contributor.authorPawlak, Bartek
dc.contributor.authorVellianitis, Georgios
dc.contributor.authorDuriez, Blandine
dc.contributor.authorMerelle, Thomas
dc.contributor.authorAbsil, Philippe
dc.contributor.authorBiesemans, Serge
dc.contributor.authorJurczak, Gosia
dc.contributor.authorHoffmann, Thomas Y.
dc.contributor.authorLander, Rob
dc.date.accessioned2021-10-18T04:39:02Z
dc.date.available2021-10-18T04:39:02Z
dc.date.issued2009-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16455
dc.sourceIIOimport
dc.titleCharacteristics and integration challenges of FinFET-based devices for (Sub-)22nm technology nodes circuit applications
dc.typeProceedings paper
dc.contributor.imecauthorVeloso, Anabela
dc.contributor.imecauthorVan Dal, Mark
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorDe Keersgieter, An
dc.contributor.imecauthorWitters, Liesbeth
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorBrus, Stephan
dc.contributor.imecauthorPawlak, Bartek
dc.contributor.imecauthorVellianitis, Georgios
dc.contributor.imecauthorDuriez, Blandine
dc.contributor.imecauthorAbsil, Philippe
dc.contributor.imecauthorBiesemans, Serge
dc.contributor.imecauthorJurczak, Gosia
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.contributor.orcidimecDe Keersgieter, An::0000-0002-5527-8582
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1040
dc.source.endpage1041
dc.source.conferenceInternational Conference on Solid-State Devices and Materials - SSDM
dc.source.conferencedate7/10/2009
dc.source.conferencelocationSendai Japan
imec.availabilityPublished - open access


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