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Reduction of the premetal dielectric thermal budget for a 0.35 μm technology

dc.contributor.authorWaeterloos, Joost
dc.contributor.authorMeynen, Herman
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorCoenegrachts, Bart
dc.contributor.authorGao, Teng
dc.contributor.authorGrillaert, Joost
dc.contributor.authorVan den hove, Luc
dc.contributor.authorMaex, Karen
dc.date.accessioned2021-09-29T15:51:02Z
dc.date.available2021-09-29T15:51:02Z
dc.date.issued1996
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/1645
dc.sourceIIOimport
dc.titleReduction of the premetal dielectric thermal budget for a 0.35 μm technology
dc.typeProceedings paper
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorCoenegrachts, Bart
dc.contributor.imecauthorVan den hove, Luc
dc.contributor.imecauthorMaex, Karen
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage55
dc.source.endpage57
dc.source.conferenceProceedings of the 13th International VLSI Multilevel Interconnection Conference - VMIC
dc.source.conferencedate18/06/1996
dc.source.conferencelocationSanta Clara, CA USA
imec.availabilityPublished - imec


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