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The influence of grinding and cleaning on Deep Reactive Ion Etching

dc.contributor.authorVerdonck, Patrick
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorCotrin Teixeira, Ricardo
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorBearda, Twan
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-18T04:43:05Z
dc.date.available2021-10-18T04:43:05Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16465
dc.sourceIIOimport
dc.titleThe influence of grinding and cleaning on Deep Reactive Ion Etching
dc.typeMeeting abstract
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewyes
dc.source.conference2nd International PESM Workshop on Plasma Etch and Strip in Microelectronics - PESM
dc.source.conferencedate26/02/2009
dc.source.conferencelocationLeuven Belgium
imec.availabilityPublished - imec


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