dc.contributor.author | Vos, Ingrid | |
dc.contributor.author | Hellin, David | |
dc.contributor.author | Vrancken, Christa | |
dc.contributor.author | Geypen, Jef | |
dc.contributor.author | Bender, Hugo | |
dc.contributor.author | Vecchio, Emma | |
dc.contributor.author | Paraschiv, Vasile | |
dc.contributor.author | Vertommen, Johan | |
dc.contributor.author | Boullart, Werner | |
dc.date.accessioned | 2021-10-18T05:01:36Z | |
dc.date.available | 2021-10-18T05:01:36Z | |
dc.date.issued | 2009 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16507 | |
dc.source | IIOimport | |
dc.title | Interplay between dry etch and wet clean in patterning La2O3/HfO2-containing high-k/metal gate stacks | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Vos, Ingrid | |
dc.contributor.imecauthor | Hellin, David | |
dc.contributor.imecauthor | Vrancken, Christa | |
dc.contributor.imecauthor | Geypen, Jef | |
dc.contributor.imecauthor | Bender, Hugo | |
dc.contributor.imecauthor | Vecchio, Emma | |
dc.contributor.imecauthor | Paraschiv, Vasile | |
dc.contributor.imecauthor | Vertommen, Johan | |
dc.contributor.imecauthor | Boullart, Werner | |
dc.contributor.orcidimec | Boullart, Werner::0000-0001-7614-2097 | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 29 | |
dc.source.endpage | 36 | |
dc.source.conference | Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11 | |
dc.source.conferencedate | 4/10/2009 | |
dc.source.conferencelocation | Vienna Austria | |
imec.availability | Published - open access | |
imec.internalnotes | ECS Transactions; Vol. 25, issue 5 | |