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Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding
Publication:
Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding
Date
2009
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Zhang, Wenqi
;
Ruythooren, Wouter
Journal
Abstract
Description
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1912
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations
Metrics
Views
1912
since deposited on 2021-10-18
Acq. date: 2025-10-23
Citations