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Characterization of oxidation of the electroplated Sn for advanced flip-chip bonding

dc.contributor.authorZhang, Wenqi
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T05:42:31Z
dc.date.available2021-10-18T05:42:31Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16599
dc.sourceIIOimport
dc.titleCharacterization of oxidation of the electroplated Sn for advanced flip-chip bonding
dc.typeProceedings paper
dc.contributor.imecauthorRuythooren, Wouter
dc.source.peerreviewno
dc.source.conference17th European Microelectronics and Packaging Conference & Exhibition - EMPC
dc.source.conferencedate15/06/2009
dc.source.conferencelocationRimini Italy
imec.availabilityPublished - imec


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