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Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

dc.contributor.authorArmini, Silvia
dc.contributor.authorWilson, Chris
dc.contributor.authorMoussa, Alain
dc.contributor.authorFranquet, Alexis
dc.contributor.authorVanstreels, Kris
dc.contributor.authorAtanasova, Tanya
dc.contributor.authorRadisic, Alex
dc.contributor.authorCivale, Yann
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorBryce, George
dc.contributor.authorRuythooren, Wouter
dc.date.accessioned2021-10-18T15:16:13Z
dc.date.available2021-10-18T15:16:13Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16668
dc.sourceIIOimport
dc.titleSeed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorBryce, George
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage77
dc.source.endpage87
dc.source.conferenceElectrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)
dc.source.conferencedate24/04/2010
dc.source.conferencelocationVancouver Canada
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 28, Iss. 29


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