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Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
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Authors
Armini, Silvia
;
Wilson, Chris
;
Moussa, Alain
;
Franquet, Alexis
;
Vanstreels, Kris
;
Atanasova, Tanya
;
Radisic, Alex
;
Civale, Yann
;
Redolfi, Augusto
;
Van Ammel, Annemie
;
El-Mekki, Zaid
;
Bryce, George
;
Ruythooren, Wouter
Conference
Electrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)
Title
Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs
Publication type
Proceedings paper
Embargo date
9999-12-31
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