Publication:

Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

Date

2010
Proceedings Paper
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dc.contributor.authorArmini, Silvia
dc.contributor.authorWilson, Chris
dc.contributor.authorMoussa, Alain
dc.contributor.authorFranquet, Alexis
dc.contributor.authorVanstreels, Kris
dc.contributor.authorAtanasova, Tanya
dc.contributor.authorRadisic, Alex
dc.contributor.authorCivale, Yann
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorBryce, George
dc.contributor.authorRuythooren, Wouter
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorFranquet, Alexis
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorBryce, George
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecFranquet, Alexis::0000-0002-7371-8852
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.date.accessioned2021-10-18T15:16:13Z
dc.date.available2021-10-18T15:16:13Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16668
dc.source.beginpage77
dc.source.conferenceElectrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)
dc.source.conferencedate24/04/2010
dc.source.conferencelocationVancouver Canada
dc.source.endpage87
dc.title

Seed-less copper electrochemical deposition on PVD resistive substrates as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

dc.typeProceedings paper
dspace.entity.typePublication
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