dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Christiaens, Wim | |
dc.contributor.author | Torfs, Tom | |
dc.contributor.author | Huwel, W. | |
dc.contributor.author | Perdu, Wim | |
dc.contributor.author | Vanfleteren, Jan | |
dc.contributor.author | Iker, Francois | |
dc.contributor.author | Funaya, Takuo | |
dc.contributor.author | Buisson, Thibault | |
dc.contributor.author | De Preter, Inge | |
dc.contributor.author | Jamieson, Geraldine | |
dc.contributor.author | Soussan, Philippe | |
dc.contributor.author | Van Hoof, Chris | |
dc.date.accessioned | 2021-10-18T15:21:16Z | |
dc.date.available | 2021-10-18T15:21:16Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16748 | |
dc.source | IIOimport | |
dc.title | Ultra thin chip embedding technology (UTCS-UTCP) | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.imecauthor | Torfs, Tom | |
dc.contributor.imecauthor | Vanfleteren, Jan | |
dc.contributor.imecauthor | De Preter, Inge | |
dc.contributor.imecauthor | Jamieson, Geraldine | |
dc.contributor.imecauthor | Soussan, Philippe | |
dc.contributor.imecauthor | Van Hoof, Chris | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.contributor.orcidimec | Torfs, Tom::0000-0002-1302-3346 | |
dc.contributor.orcidimec | Vanfleteren, Jan::0000-0002-9654-7304 | |
dc.contributor.orcidimec | Jamieson, Geraldine::0000-0002-6750-097X | |
dc.contributor.orcidimec | Soussan, Philippe::0000-0002-1347-6978 | |
dc.source.peerreview | no | |
dc.source.conference | Embedded Wafer level Packaging Workshop, IMAPS-France | |
dc.source.conferencedate | 24/06/2010 | |
dc.source.conferencelocation | Gernoble France | |
imec.availability | Published - imec | |