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Ultra thin chip embedding technology (UTCS-UTCP)

dc.contributor.authorBeyne, Eric
dc.contributor.authorChristiaens, Wim
dc.contributor.authorTorfs, Tom
dc.contributor.authorHuwel, W.
dc.contributor.authorPerdu, Wim
dc.contributor.authorVanfleteren, Jan
dc.contributor.authorIker, Francois
dc.contributor.authorFunaya, Takuo
dc.contributor.authorBuisson, Thibault
dc.contributor.authorDe Preter, Inge
dc.contributor.authorJamieson, Geraldine
dc.contributor.authorSoussan, Philippe
dc.contributor.authorVan Hoof, Chris
dc.date.accessioned2021-10-18T15:21:16Z
dc.date.available2021-10-18T15:21:16Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16748
dc.sourceIIOimport
dc.titleUltra thin chip embedding technology (UTCS-UTCP)
dc.typeOral presentation
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorJamieson, Geraldine
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.contributor.orcidimecJamieson, Geraldine::0000-0002-6750-097X
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.conferenceEmbedded Wafer level Packaging Workshop, IMAPS-France
dc.source.conferencedate24/06/2010
dc.source.conferencelocationGernoble France
imec.availabilityPublished - imec


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