dc.contributor.author | Carbonell, Laure | |
dc.contributor.author | Caluwaerts, Rudy | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | Heylen, Nancy | |
dc.contributor.author | Kellens, Kristof | |
dc.contributor.author | Mertens, Sofie | |
dc.contributor.author | Van Ammel, Annemie | |
dc.contributor.author | Van Roey, Frieda | |
dc.contributor.author | Cockburn, Andrew | |
dc.contributor.author | Gravey, Virgine | |
dc.contributor.author | Shah, Kavita | |
dc.contributor.author | Rajagopalan, Ravi | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-18T15:29:15Z | |
dc.date.available | 2021-10-18T15:29:15Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/16823 | |
dc.source | IIOimport | |
dc.title | Metallization options for sub- 30 nm interconnects: comparison of Cu and W metallizations | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Caluwaerts, Rudy | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | Heylen, Nancy | |
dc.contributor.imecauthor | Kellens, Kristof | |
dc.contributor.imecauthor | Mertens, Sofie | |
dc.contributor.imecauthor | Van Ammel, Annemie | |
dc.contributor.imecauthor | Van Roey, Frieda | |
dc.contributor.imecauthor | Cockburn, Andrew | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Mertens, Sofie::0000-0002-1482-6730 | |
dc.source.peerreview | no | |
dc.source.conference | Advanced Metallization Conference - AMC | |
dc.source.conferencedate | 5/10/2010 | |
dc.source.conferencelocation | Albany, NY. USA | |
imec.availability | Published - imec | |