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Wafer bevel protection during deep reactive ion etching

dc.contributor.authorCharavel, Remy
dc.contributor.authorGassot, Pierre
dc.contributor.authorde Backer, E.
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorDevriendt, Katia
dc.contributor.authorVan Wichelen, Koen
dc.date.accessioned2021-10-18T15:31:29Z
dc.date.available2021-10-18T15:31:29Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16841
dc.sourceIIOimport
dc.titleWafer bevel protection during deep reactive ion etching
dc.typeOral presentation
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorDevriendt, Katia
dc.contributor.orcidimecDevriendt, Katia::0000-0002-0662-7926
dc.source.peerreviewno
dc.source.conference13th Technical and Scientific Meeting of ARCSIS : 'Manufacturing Challenges in European Semiconductor Fabs'
dc.source.conferencedate18/11/2010
dc.source.conferencelocationRousset France
imec.availabilityPublished - imec


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