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Via-last airgap liner TSV for ultra-low capacitance applications

dc.contributor.authorCivale, Yann
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T15:36:37Z
dc.date.available2021-10-18T15:36:37Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16875
dc.sourceIIOimport
dc.titleVia-last airgap liner TSV for ultra-low capacitance applications
dc.typeProceedings paper
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.source.peerreviewno
dc.source.conferenceIEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate16/11/2010
dc.source.conferencelocationMünchen Germany
imec.availabilityPublished - imec


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