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CMOS compatible anodization process for low cost high density capacitors

dc.contributor.authorDetalle, Mikael
dc.contributor.authorRakowski, Michal
dc.contributor.authorPotoms, Goedele
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorde Potter de ten Broeck, Muriel
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-18T16:01:26Z
dc.date.available2021-10-18T16:01:26Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17015
dc.sourceIIOimport
dc.titleCMOS compatible anodization process for low cost high density capacitors
dc.typeProceedings paper
dc.contributor.imecauthorDetalle, Mikael
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorde Potter de ten Broeck, Muriel
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage107
dc.source.endpage115
dc.source.conferenceProcessing, Materials, and Integration of Damascene and 3D Interconnects
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 33, Iss. 12


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