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Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding

dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorCivale, Yann
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorJourdain, Anne
dc.contributor.authorSood, Sumant
dc.contributor.authorFarrens, Shari
dc.contributor.authorSoussan, Philippe
dc.date.accessioned2021-10-18T17:16:00Z
dc.date.available2021-10-18T17:16:00Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17298
dc.sourceIIOimport
dc.titleCu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
dc.typeProceedings paper
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.source.peerreviewno
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate6/06/2010
dc.source.conferencelocationSan-Fransisco, CA USA
imec.availabilityPublished - imec


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