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300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications

dc.contributor.authorJourdain, Anne
dc.contributor.authorBuisson, Thibault
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorPrivett, Marc
dc.contributor.authorWallace, Daniel
dc.contributor.authorSood, Sumant
dc.contributor.authorBisson, Peter
dc.contributor.authorBeyne, Eric
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSwinnen, Bart
dc.date.accessioned2021-10-18T17:25:05Z
dc.date.available2021-10-18T17:25:05Z
dc.date.issued2010-11
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17327
dc.sourceIIOimport
dc.title300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
dc.typeMeeting abstract
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewno
dc.source.conferenceIEEE International 3D System Integration Conference - 3DIC
dc.source.conferencedate16/11/2010
dc.source.conferencelocationMunich Germany
imec.availabilityPublished - imec


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