Capacitance reduction technique for through silicon via (TSV) in p-Si substrate

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Authors

Katti, Guruprasad; Stucchi, Michele; De Meyer, Kristin; Dehaene, Wim

ISSN

0741-3106

Issue

6

Journal

IEEE Electron Device Letters

Volume

31

Title

Capacitance reduction technique for through silicon via (TSV) in p-Si substrate

Publication type

Journal article

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