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Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking

dc.contributor.authorLabie, Riet
dc.contributor.authorLimaye, Paresh
dc.contributor.authorLee, K.W.
dc.contributor.authorBerry, C.J.
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Wolf, Ingrid
dc.date.accessioned2021-10-18T17:54:54Z
dc.date.available2021-10-18T17:54:54Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17421
dc.sourceIIOimport
dc.titleReliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
dc.typeProceedings paper
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.source.peerreviewno
dc.source.conferenceElectronics System Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2010
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - imec


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