Electrical characterization, modeling and reliability analysis of a via last TSV

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Authors
Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz; Vandevelde, Bart; Duval, Fabrice; Soussan, Philippe; Beyne, Eric
Conference
12th Electronics Packaging Technology Conference - EPTC
Title
Electrical characterization, modeling and reliability analysis of a via last TSV
Publication type
Proceedings paper
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