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Challenges and emerging solutions for testing TSV-based 3D stacked ICs

dc.contributor.authorMarinissen, Erik Jan
dc.date.accessioned2021-10-18T18:49:50Z
dc.date.available2021-10-18T18:49:50Z
dc.date.issued2010-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17582
dc.sourceIIOimport
dc.titleChallenges and emerging solutions for testing TSV-based 3D stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewno
dc.source.beginpage1
dc.source.conferenceIEEE Custom Integrated Circuit Conference - CICC
dc.source.conferencedate20/09/2010
dc.source.conferencelocationSan Jose, CA USA
imec.availabilityPublished - imec


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