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dc.contributor.authorMinas, Nikolaos
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorOprins, Herman
dc.contributor.authorYang, Yu
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorPerry, Dan
dc.contributor.authorMarchal, Pol
dc.contributor.authorRakowski, Michal
dc.contributor.authorCherman, Vladimir
dc.date.accessioned2021-10-18T19:09:45Z
dc.date.available2021-10-18T19:09:45Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17634
dc.sourceIIOimport
dc.titleTest structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
dc.typeProceedings paper
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorRakowski, Michal
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.source.peerreviewyes
dc.source.beginpage140
dc.source.endpage144
dc.source.conference23rd IEEE International Conference on Microelectronic Test Structures - ICMTS
dc.source.conferencedate22/03/2010
dc.source.conferencelocationHiroshima Japan
imec.availabilityPublished - imec


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