dc.contributor.author | Minas, Nikolaos | |
dc.contributor.author | Van der Plas, Geert | |
dc.contributor.author | Oprins, Herman | |
dc.contributor.author | Yang, Yu | |
dc.contributor.author | Okoro, Chukwudi | |
dc.contributor.author | Mercha, Abdelkarim | |
dc.contributor.author | Torregiani, Cristina | |
dc.contributor.author | Perry, Dan | |
dc.contributor.author | Marchal, Pol | |
dc.contributor.author | Rakowski, Michal | |
dc.contributor.author | Cherman, Vladimir | |
dc.date.accessioned | 2021-10-18T19:09:45Z | |
dc.date.available | 2021-10-18T19:09:45Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17634 | |
dc.source | IIOimport | |
dc.title | Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design | |
dc.type | Proceedings paper | |
dc.contributor.imecauthor | Van der Plas, Geert | |
dc.contributor.imecauthor | Oprins, Herman | |
dc.contributor.imecauthor | Mercha, Abdelkarim | |
dc.contributor.imecauthor | Rakowski, Michal | |
dc.contributor.imecauthor | Cherman, Vladimir | |
dc.contributor.orcidimec | Van der Plas, Geert::0000-0002-4975-6672 | |
dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
dc.contributor.orcidimec | Mercha, Abdelkarim::0000-0002-2174-6958 | |
dc.source.peerreview | yes | |
dc.source.beginpage | 140 | |
dc.source.endpage | 144 | |
dc.source.conference | 23rd IEEE International Conference on Microelectronic Test Structures - ICMTS | |
dc.source.conferencedate | 22/03/2010 | |
dc.source.conferencelocation | Hiroshima Japan | |
imec.availability | Published - imec | |