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Test-architecture optimization for TSV-based 3D stacked ICs
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Authors
Noia, Brandon
;
Goel, Sandeep Kumar
;
Chakrabarty, Krishnendu
;
Marinissen, Erik Jan
;
Verbree, Jouke
Conference
IEEE European Test Symposium - ETS
Title
Test-architecture optimization for TSV-based 3D stacked ICs
Publication type
Proceedings paper
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