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Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

dc.contributor.authorOprins, Herman
dc.contributor.authorCherman, Vladimir
dc.contributor.authorTorregiani, Cristina
dc.contributor.authorStucchi, Michele
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.date.accessioned2021-10-18T19:53:45Z
dc.date.available2021-10-18T19:53:45Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17743
dc.sourceIIOimport
dc.titleThermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
dc.typeProceedings paper
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.source.peerreviewyes
dc.source.conferenceElectronics System Integration Technology Conference - ESTC
dc.source.conferencedate13/09/2010
dc.source.conferencelocationBerlin Germany
imec.availabilityPublished - imec


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