Publication:

Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

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1955 since deposited on 2021-10-18
4last month
Acq. date: 2026-05-28

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Views

1955 since deposited on 2021-10-18
4last month
Acq. date: 2026-05-28

Citations