Publication:

Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

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1952 since deposited on 2021-10-18
6last month
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Acq. date: 2026-04-30

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1952 since deposited on 2021-10-18
6last month
2last week
Acq. date: 2026-04-30

Citations