Publication:
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
Date
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Torregiani, Cristina | |
| dc.contributor.author | Stucchi, Michele | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Stucchi, Michele | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-18T19:53:45Z | |
| dc.date.available | 2021-10-18T19:53:45Z | |
| dc.date.issued | 2010 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17743 | |
| dc.source.conference | Electronics System Integration Technology Conference - ESTC | |
| dc.source.conferencedate | 13/09/2010 | |
| dc.source.conferencelocation | Berlin Germany | |
| dc.title | Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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