Publication:
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
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1944 since deposited on 2021-10-18
3last month
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Acq. date: 2026-01-08
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Views
1944 since deposited on 2021-10-18
3last month
2last week
Acq. date: 2026-01-08
Citations