Publication:
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1941 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
Citations
Metrics
Views
1941 since deposited on 2021-10-18
1last month
Acq. date: 2025-12-15
Citations