Publication:

Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

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1957 since deposited on 2021-10-18
2last month
Acq. date: 2026-07-19

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Views

1957 since deposited on 2021-10-18
2last month
Acq. date: 2026-07-19

Citations