Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs

Publication:

2010

Proceedings Paper

Author(s)

;

;

;

Stucchi, Michele

;

Vandevelde, Bart

;

Beyne, Eric

1966 since deposited on 2021-10-18

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Acq. date: 2026-09-15