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Copper plating on resistive substrates, diffusion barrier and alternative seed layers

dc.contributor.authorRadisic, Alex
dc.contributor.authorNagar, Magi
dc.contributor.authorStrubbe, K.
dc.contributor.authorArmini, Silvia
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorVolders, Henny
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-18T20:42:24Z
dc.date.available2021-10-18T20:42:24Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17865
dc.sourceIIOimport
dc.titleCopper plating on resistive substrates, diffusion barrier and alternative seed layers
dc.typeProceedings paper
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorVolders, Henny
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage175
dc.source.endpage184
dc.source.conferenceSemiconductors, Metal Oxides, and Composites: Metallization and Electrodeposition of Thin Films and Nanostructures
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna Austria
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 25, issue 27


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