dc.contributor.author | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.author | Pham, Nga | |
dc.contributor.author | Majeed, Bivragh | |
dc.contributor.author | Civale, Yann | |
dc.contributor.author | Beyne, Eric | |
dc.date.accessioned | 2021-10-18T21:07:26Z | |
dc.date.available | 2021-10-18T21:07:26Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17924 | |
dc.source | IIOimport | |
dc.title | Use of polymer liners for 3D-WLP TSVs: process, reliability and cost | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Sabuncuoglu Tezcan, Deniz | |
dc.contributor.imecauthor | Pham, Nga | |
dc.contributor.imecauthor | Majeed, Bivragh | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Sabuncuoglu Tezcan, Deniz::0000-0002-9237-7862 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | no | |
dc.source.beginpage | 1675 | |
dc.source.conference | 218th ECS Meeting Symposium 'Processing, Materials, and Integration of Damascene and 3D Interconnects' | |
dc.source.conferencedate | 10/10/2010 | |
dc.source.conferencelocation | Las Vegas, NV USA | |
imec.availability | Published - open access | |
imec.internalnotes | Meeting Abstracts; Vol. 2010-02 | |