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Influence of the top chamber window temperature on the STI etch process

dc.contributor.authorShamiryan, Denis
dc.contributor.authorDanilkin, Evgeny
dc.contributor.authorTinck, Stefan
dc.contributor.authorKlick, Michael
dc.contributor.authorMilenin, Alexey
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-18T21:28:14Z
dc.date.available2021-10-18T21:28:14Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17973
dc.sourceIIOimport
dc.titleInfluence of the top chamber window temperature on the STI etch process
dc.typeProceedings paper
dc.contributor.imecauthorMilenin, Alexey
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecMilenin, Alexey::0000-0003-0747-0462
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage731
dc.source.endpage736
dc.source.conferenceChina Semiconductor Technology International Conference - CSTIC
dc.source.conferencedate18/03/2010
dc.source.conferencelocationShanghai China
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 27, Issue 1


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