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Thermal modeling and experimental validation of thermal effects of 3D-ICs

dc.contributor.authorSrinivasan, Adi
dc.contributor.authorCheng, Edmund
dc.contributor.authorOprins, Herman
dc.contributor.authorVan der Plas, Geert
dc.date.accessioned2021-10-18T21:52:01Z
dc.date.available2021-10-18T21:52:01Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18025
dc.sourceIIOimport
dc.titleThermal modeling and experimental validation of thermal effects of 3D-ICs
dc.typeOral presentation
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.source.peerreviewno
dc.source.conference3D Integration Workshop at DATE 2010
dc.source.conferencedate12/03/2010
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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