Show simple item record

Die-to-die adhesive bonding for evanescently-coupled photonic devices

dc.contributor.authorStankovic, Stevan
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorRoelkens, Gunther
dc.contributor.authorJones, R.
dc.contributor.authorHeck, J.
dc.contributor.authorSysak, M.
dc.date.accessioned2021-10-18T21:57:58Z
dc.date.available2021-10-18T21:57:58Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18037
dc.sourceIIOimport
dc.titleDie-to-die adhesive bonding for evanescently-coupled photonic devices
dc.typeMeeting abstract
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage1739
dc.source.conference218th ECS Meeting
dc.source.conferencedate10/10/2010
dc.source.conferencelocationLas Vegas, NV USA
imec.availabilityPublished - open access
imec.internalnotesECS Meeting Abstracts; Vol. MA2010-02


Files in this item

Thumbnail
Name:
21759.pdf
Size:
285.5Kb
Format:
PDF
View/open

This item appears in the following collection(s)

Show simple item record