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On maximizing the compound yield for 3D wafer-to-wafer stacked ICs
Publication:
On maximizing the compound yield for 3D wafer-to-wafer stacked ICs
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Date
2010-10
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Taouil, Mottaqiallah
;
Hamdioui, Said
;
Verbree, Jouke
;
Marinissen, Erik Jan
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Views
1917
since deposited on 2021-10-18
1
last month
1
last week
Acq. date: 2025-12-14
Citations