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ESD evaluation of 3D SIC technology using TSV

dc.contributor.authorThijs, Steven
dc.contributor.authorLinten, Dimitri
dc.contributor.authorScholz, Mirko
dc.contributor.authorMercha, Abdelkarim
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorTravaly, Youssef
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorGroeseneken, Guido
dc.date.accessioned2021-10-18T22:18:07Z
dc.date.available2021-10-18T22:18:07Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18081
dc.sourceIIOimport
dc.titleESD evaluation of 3D SIC technology using TSV
dc.typeOral presentation
dc.contributor.imecauthorThijs, Steven
dc.contributor.imecauthorLinten, Dimitri
dc.contributor.imecauthorMercha, Abdelkarim
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorGroeseneken, Guido
dc.contributor.orcidimecThijs, Steven::0000-0003-2889-8345
dc.contributor.orcidimecLinten, Dimitri::0000-0001-8434-1838
dc.contributor.orcidimecMercha, Abdelkarim::0000-0002-2174-6958
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.conferenceInternational ESD Workshop - IEW
dc.source.conferencedate10/05/2010
dc.source.conferencelocationTutzing Germany
imec.availabilityPublished - open access


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