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Dry etch solutions for 3D integration technology

dc.contributor.authorTutunjyan, Nina
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorMajeed, Bivragh
dc.contributor.authorBuisson, Thibault
dc.contributor.authorCivale, Yann
dc.contributor.authorBoullart, Werner
dc.date.accessioned2021-10-18T22:31:29Z
dc.date.available2021-10-18T22:31:29Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18109
dc.sourceIIOimport
dc.titleDry etch solutions for 3D integration technology
dc.typeMeeting abstract
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorBoullart, Werner
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecBoullart, Werner::0000-0001-7614-2097
dc.source.peerreviewyes
dc.source.conference3rd Plasma Etch and Strip in Microelectronics Workshop - PESM
dc.source.conferencedate4/03/2010
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec


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