dc.contributor.author | Van Olmen, Jan | |
dc.contributor.author | Huyghebaert, Cedric | |
dc.contributor.author | Coenen, Jens | |
dc.contributor.author | Van Aelst, Joke | |
dc.contributor.author | Sleeckx, Erik | |
dc.contributor.author | Van Ammel, Annemie | |
dc.contributor.author | Armini, Silvia | |
dc.contributor.author | Vaes, Jan | |
dc.contributor.author | Beyne, Eric | |
dc.contributor.author | Travaly, Youssef | |
dc.date.accessioned | 2021-10-18T23:12:24Z | |
dc.date.available | 2021-10-18T23:12:24Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18198 | |
dc.source | IIOimport | |
dc.title | Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration | |
dc.type | Meeting abstract | |
dc.contributor.imecauthor | Van Olmen, Jan | |
dc.contributor.imecauthor | Huyghebaert, Cedric | |
dc.contributor.imecauthor | Van Aelst, Joke | |
dc.contributor.imecauthor | Sleeckx, Erik | |
dc.contributor.imecauthor | Van Ammel, Annemie | |
dc.contributor.imecauthor | Armini, Silvia | |
dc.contributor.imecauthor | Beyne, Eric | |
dc.contributor.orcidimec | Huyghebaert, Cedric::0000-0001-6043-7130 | |
dc.contributor.orcidimec | Sleeckx, Erik::0000-0003-2560-6132 | |
dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
dc.date.embargo | 9999-12-31 | |
dc.source.peerreview | yes | |
dc.source.conference | Materials for Advanced Metallization - MAM | |
dc.source.conferencedate | 7/03/2010 | |
dc.source.conferencelocation | Mechelen Belgium | |
imec.availability | Published - open access | |