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Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration

dc.contributor.authorVan Olmen, Jan
dc.contributor.authorHuyghebaert, Cedric
dc.contributor.authorCoenen, Jens
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorSleeckx, Erik
dc.contributor.authorVan Ammel, Annemie
dc.contributor.authorArmini, Silvia
dc.contributor.authorVaes, Jan
dc.contributor.authorBeyne, Eric
dc.contributor.authorTravaly, Youssef
dc.date.accessioned2021-10-18T23:12:24Z
dc.date.available2021-10-18T23:12:24Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18198
dc.sourceIIOimport
dc.titleIntegration challenges of copper Through Silicon Via (TSV) metallization for 3D-Stacked IC integration
dc.typeMeeting abstract
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorHuyghebaert, Cedric
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorSleeckx, Erik
dc.contributor.imecauthorVan Ammel, Annemie
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecHuyghebaert, Cedric::0000-0001-6043-7130
dc.contributor.orcidimecSleeckx, Erik::0000-0003-2560-6132
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate7/03/2010
dc.source.conferencelocationMechelen Belgium
imec.availabilityPublished - open access


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