Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafers

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Authors
Verbree, Jouke; Marinissen, Erik Jan; Roussel, Philippe; Velenis, Dimitrios
Conference
3D Integration Workshop at DATE 2010
Title
Cost-effectiveness of wafer-to-wafer 3D chip stacking with matching pre-tested wafers
Publication type
Oral presentation
Embargo date
9999-12-31
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