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Design and application of a sensor to monitor stress in deep submicron copper interconnects

dc.contributor.authorWilson, Chris
dc.contributor.authorCroes, Kristof
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.contributor.authorHorsfall, A.
dc.contributor.authorNeill, A.
dc.date.accessioned2021-10-19T00:29:26Z
dc.date.available2021-10-19T00:29:26Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18357
dc.sourceIIOimport
dc.titleDesign and application of a sensor to monitor stress in deep submicron copper interconnects
dc.typeProceedings paper
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpage133
dc.source.endpage138
dc.source.conferenceStress-Induced Phenomena in Metallization: 11th International Workshop
dc.source.conferencedate11/04/2010
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - open access
imec.internalnotesAIP Conference Proceedings; Vol. 1300


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