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Simulation of the effect of microstructure on the elastic properties of copper interconnects

dc.contributor.authorWilson, Chris
dc.contributor.authorOila, A.
dc.contributor.authorSanderson, L.
dc.contributor.authorBull, S.
dc.contributor.authorRaskin, Jean-Pierre
dc.contributor.authorCroes, Kristof
dc.contributor.authorHorsfall, A.
dc.contributor.authorO'Neill, A.
dc.contributor.authorTokei, Zsolt
dc.contributor.authorBeyer, Gerald
dc.date.accessioned2021-10-19T00:29:57Z
dc.date.available2021-10-19T00:29:57Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18358
dc.sourceIIOimport
dc.titleSimulation of the effect of microstructure on the elastic properties of copper interconnects
dc.typeOral presentation
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.source.peerreviewno
dc.source.conference11th International Workshop on Stress-Induced Phenomena in Metallization
dc.source.conferencedate11/04/2010
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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