Publication:
Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers
Date
Loading...
Journal
Abstract
Description
Metrics
Views
1841 since deposited on 2021-10-19
Acq. date: 2026-01-07
Citations
Metrics
Views
1841 since deposited on 2021-10-19
Acq. date: 2026-01-07
Citations