dc.contributor.author | Wilson, Chris | |
dc.contributor.author | Zhao, Chao | |
dc.contributor.author | Volders, Henny | |
dc.contributor.author | Zhao, Larry | |
dc.contributor.author | Croes, Kristof | |
dc.contributor.author | Tokei, Zsolt | |
dc.contributor.author | Beyer, Gerald | |
dc.date.accessioned | 2021-10-19T00:31:02Z | |
dc.date.available | 2021-10-19T00:31:02Z | |
dc.date.issued | 2010 | |
dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/18360 | |
dc.source | IIOimport | |
dc.title | Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers | |
dc.type | Oral presentation | |
dc.contributor.imecauthor | Wilson, Chris | |
dc.contributor.imecauthor | Volders, Henny | |
dc.contributor.imecauthor | Croes, Kristof | |
dc.contributor.imecauthor | Tokei, Zsolt | |
dc.contributor.imecauthor | Beyer, Gerald | |
dc.contributor.orcidimec | Croes, Kristof::0000-0002-3955-0638 | |
dc.source.peerreview | no | |
dc.source.conference | Materials for Advanced Metallization - MAM | |
dc.source.conferencedate | 7/03/2010 | |
dc.source.conferencelocation | Mechelen Belgium | |
imec.availability | Published - imec | |