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Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration

dc.contributor.authorWostyn, Kurt
dc.contributor.authorZhao, Ming
dc.contributor.authorCui, Hushan
dc.contributor.authorLaermans, Patrick
dc.contributor.authorJourdain, Anne
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorStruyf, Herbert
dc.contributor.authorDe Strycker, Steven
dc.contributor.authorClaes, Martine
dc.contributor.authorTravaly, Youssef
dc.contributor.authorLeunissen, Peter
dc.date.accessioned2021-10-19T00:37:10Z
dc.date.available2021-10-19T00:37:10Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18371
dc.sourceIIOimport
dc.titleCleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC) integration
dc.typeMeeting abstract
dc.contributor.imecauthorWostyn, Kurt
dc.contributor.imecauthorZhao, Ming
dc.contributor.imecauthorLaermans, Patrick
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorClaes, Martine
dc.contributor.orcidimecWostyn, Kurt::0000-0003-3995-0292
dc.contributor.orcidimecZhao, Ming::0000-0002-0856-851X
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage188
dc.source.endpage189
dc.source.conference10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS
dc.source.conferencedate19/09/2010
dc.source.conferencelocationOostende Belgium
imec.availabilityPublished - open access


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