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On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices

dc.contributor.authorAckaert, Jan
dc.contributor.authorVanderstraeten, Daniel
dc.contributor.authorVandevelde, Bart
dc.date.accessioned2021-10-19T12:28:19Z
dc.date.available2021-10-19T12:28:19Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18445
dc.sourceIIOimport
dc.titleOn the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices
dc.typeProceedings paper
dc.contributor.imecauthorAckaert, Jan
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.source.peerreviewyes
dc.source.conferenceIEEE International Conference on IC Design and Technology - ICICDT
dc.source.conferencedate2/05/2011
dc.source.conferencelocationKaohsiung Taiwan
imec.availabilityPublished - imec


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