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Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments

dc.contributor.authorArmini, Silvia
dc.contributor.authorDemuynck, Steven
dc.contributor.authorEl-Mekki, Zaid
dc.contributor.authorSwerts, Johan
dc.contributor.authorNagar, Magi
dc.contributor.authorRadisic, Alex
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorLeunissen, Peter
dc.contributor.authorVereecken, Philippe
dc.date.accessioned2021-10-19T12:29:30Z
dc.date.available2021-10-19T12:29:30Z
dc.date.issued2011-05
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18487
dc.sourceIIOimport
dc.titleDirect copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and ½ pitch lines: from coupon to full-wafer experiments
dc.typeProceedings paper
dc.contributor.imecauthorArmini, Silvia
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorEl-Mekki, Zaid
dc.contributor.imecauthorSwerts, Johan
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecArmini, Silvia::0000-0003-0578-3422
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.contributor.orcidimecEl-Mekki, Zaid::0000-0002-9851-9139
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage117
dc.source.endpage123
dc.source.conferenceSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
dc.source.conferencedate1/05/2011
dc.source.conferencelocationMontreal Canada
imec.availabilityPublished - imec
imec.internalnotesECS Transactions; Vol. 35, Issue 2


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