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Ultra low dielectric constant materials for 22 nm technology node and beyond

dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorSmirnov, Evgeny
dc.contributor.authorZhao, Larry
dc.date.accessioned2021-10-19T12:31:25Z
dc.date.available2021-10-19T12:31:25Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18523
dc.sourceIIOimport
dc.titleUltra low dielectric constant materials for 22 nm technology node and beyond
dc.typeProceedings paper
dc.date.embargo9999-12-31
dc.source.peerreviewyes
dc.source.beginpage717
dc.source.endpage728
dc.source.conferenceSilicon Nitride, Silicon Dioxide, and Emerging Dielectrics 11
dc.source.conferencedate1/05/2011
dc.source.conferencelocationMontreal Canada
imec.availabilityPublished - open access
imec.internalnotesECS Transactions; Vol. 35, Iss. 4


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