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A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

dc.contributor.authorBogaerts, Lieve
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorRottenberg, Xavier
dc.contributor.authorNaito, Yasyuki
dc.contributor.authorDe Coster, Jeroen
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorVan Hoovels, Nele
dc.contributor.authorCherman, Vladimir
dc.contributor.authorHelin, Philippe
dc.contributor.authorOnishi, K.
dc.contributor.authorTilmans, Harrie
dc.date.accessioned2021-10-19T12:36:39Z
dc.date.available2021-10-19T12:36:39Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18590
dc.sourceIIOimport
dc.titleA MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding
dc.typeProceedings paper
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorRottenberg, Xavier
dc.contributor.imecauthorDe Coster, Jeroen
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorVan Hoovels, Nele
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorHelin, Philippe
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.source.peerreviewno
dc.source.beginpageB27
dc.source.conference22nd Micromechanics and Micro systems Europe Workshop - MME
dc.source.conferencedate19/06/2011
dc.source.conferencelocationTonsberg Norway
imec.availabilityPublished - imec


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