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Advanced use of therma-probe for ultra-shallow junction monitoring

dc.contributor.authorBogdanowicz, Janusz
dc.contributor.authorClarysse, Trudo
dc.contributor.authorSmets, Gerrit
dc.contributor.authorRosseel, Erik
dc.contributor.authorVandervorst, Wilfried
dc.date.accessioned2021-10-19T12:37:26Z
dc.date.available2021-10-19T12:37:26Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18598
dc.sourceIIOimport
dc.titleAdvanced use of therma-probe for ultra-shallow junction monitoring
dc.typeProceedings paper
dc.contributor.imecauthorBogdanowicz, Janusz
dc.contributor.imecauthorSmets, Gerrit
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.orcidimecBogdanowicz, Janusz::0000-0002-7503-8922
dc.source.peerreviewno
dc.source.beginpage208
dc.source.endpage211
dc.source.conferenceFrontiers of Characterization and Metrology for Nanoelectronics
dc.source.conferencedate23/05/2011
dc.source.conferencelocationGrenoble France
imec.availabilityPublished - imec
imec.internalnotesAIP Conference Series; Vol. 1395


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