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Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base

dc.contributor.authorChi, Chun-Chuan
dc.contributor.authorMarinissen, Erik Jan
dc.contributor.authorGoel, Sandeep Kumar
dc.contributor.authorWu, Cheng-Wen
dc.date.accessioned2021-10-19T12:47:45Z
dc.date.available2021-10-19T12:47:45Z
dc.date.issued2011-09
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18681
dc.sourceIIOimport
dc.titlePost-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
dc.typeProceedings paper
dc.contributor.imecauthorMarinissen, Erik Jan
dc.contributor.orcidimecMarinissen, Erik Jan::0000-0002-5058-8303
dc.source.peerreviewyes
dc.source.beginpage1
dc.source.endpage10
dc.source.conferenceIEEE International Test Conference - ITC
dc.source.conferencedate20/09/2011
dc.source.conferencelocationAnaheim, CA USA
imec.availabilityPublished - imec


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