Publication:
Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base
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1891 since deposited on 2021-10-19
Acq. date: 2026-01-27
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Statistics
Views
1891 since deposited on 2021-10-19
Acq. date: 2026-01-27
Citations