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Reliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials

dc.contributor.authorCroes, Kristof
dc.contributor.authorDemuynck, Steven
dc.contributor.authorSiew, Yong Kong
dc.contributor.authorWilson, Chris
dc.contributor.authorHeylen, Nancy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorTokei, Zsolt
dc.date.accessioned2021-10-19T12:58:45Z
dc.date.available2021-10-19T12:58:45Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18751
dc.sourceIIOimport
dc.titleReliability performance of advanced metallization options for 30nm ½ pitch in SiCOH low-k materials
dc.typeProceedings paper
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorWilson, Chris
dc.contributor.imecauthorHeylen, Nancy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.embargo9999-12-31
dc.source.peerreviewno
dc.source.beginpageP1.5
dc.source.conferenceIEEE International Interconnect Technology Conference and Materials for Advanced Metallization - IITC/MAM
dc.source.conferencedate9/05/2011
dc.source.conferencelocationDresden Germany
imec.availabilityPublished - imec


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